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International Electronics Circuit Exhibition (Shenzhen) – HKPCA Show 2026 will take place from 2–4 December 2026 at the Shenzhen World Exhibition & Convention Center (Bao’an), Shenzhen, China. Under the theme “AI Powers Technology”, the exhibition brings together PCB manufacturers, electronics assembly companies, materials suppliers, equipment manufacturers, technology providers, engineers, procurement professionals, and global buyers. Visitors can explore technologies across the complete PCB and PCBA industry chain, including advanced circuit boards, electronic assembly, intelligent manufacturing, inspection equipment, advanced packaging, and high-performance electronic materials.

Event Details
  • Exhibition:
    International Electronics Circuit Exhibition (Shenzhen) – HKPCA Show 2026
  • Edition:
    2026 Edition
  • Dates:
    2–4 December 2026
  • Days & Timing:
    • Wednesday, 2 December: 10:00 AM – 5:00 PM
    • Thursday, 3 December: 9:00 AM – 5:00 PM
    • Friday, 4 December: 9:00 AM – 4:00 PM
  • Venue:
    Shenzhen World Exhibition & Convention Center (Bao’an)
  • Location:
    Shenzhen, Guangdong, China
  • Industry:
    PCB, PCBA, Electronic Circuits & Electronics Manufacturing
Exhibition Focus
  • Printed Circuit Boards (PCB): High-density interconnect boards, multilayer PCBs, flexible and rigid-flex circuits, high-frequency boards, and advanced PCB technologies
  • Electronic Assembly & PCBA: SMT technologies, electronic assembly equipment, soldering systems, production solutions, and PCB assembly technologies
  • High-Performance Materials: Copper-clad laminates, electronic materials, high-frequency and high-speed materials, substrates, chemicals, and specialised PCB materials
  • AI & Intelligent Manufacturing: Artificial intelligence, smart production systems, industrial automation, robotics, intelligent inspection, predictive maintenance, and digital manufacturing
  • Lithography & Inspection Equipment: Imaging systems, exposure technologies, optical inspection, testing equipment, measurement systems, and quality-control solutions
  • Advanced Packaging & Testing: Semiconductor packaging, IC substrates, advanced packaging processes, testing technologies, and electronics integration solutions
  • Precision Components: Connectors, electronic components, precision parts, sensors, specialised components, and supporting electronics technologies
  • New Energy & Automotive Electronics: PCB technologies and electronic solutions for electric vehicles, automotive systems, energy applications, and intelligent mobility
  • AI Computing & Data Centre Applications: High-end PCB technologies supporting AI servers, high-performance computing, telecommunications, data centres, and advanced digital infrastructure




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